12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control

Product Details
Customization: Available
Structure: Multilayer Rigid PCB
Dielectric: FR-4
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  • 12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
  • 12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
  • 12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
  • 12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
  • 12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
  • 12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
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Basic Info.

Model NO.
GW-1920421893
Application
Consumer Electronics
Flame Retardant Properties
V0
Processing Technology
Electrolytic Foil
Production Process
Additive Process
Base Material
Copper
Insulation Materials
Metal Composite Materials
Brand
1
Transport Package
1
Specification
1
Trademark
1
Origin
Made in China
HS Code
8534001000
Production Capacity
50000PCS/Year

Packaging & Delivery

Package Size
10.00cm * 10.00cm * 10.00cm
Package Gross Weight
1.000kg

Product Description

Products Type: Consumer Electronics HDI Board
Count:12Layer (2+N+2)
Board Thickness: 1.6mm
Board Size: 70mm*90mm
Material:FR4 Tg170
Min. Drilling:0.1mm
Surface Finished: Immersion Gold
Application Fields:Consumer Electronics
Specialty:Overlay blind and buried via
 
HDI Layer Count  4L-32L mass production, 34L-64L quick-turn
Material High Tg material (Recommend Shengyi Material)
Finished Board Thickness 0.8-4.8mm
Finished Copper Thickness Hoz-8oz
Max. Board Size 600X800mm
Min. Drilling Size 0.15mm, 0.1mm(laser drilling)
Blind/Buried vias depth ratio 1:1
Min. Line Width/Space inner 2/2mil, outer 3/3mil
Surface Finish ENIG, Immersiong Silver, Immersion Sn, Plated Gold, Plated Sn, OSP ect.
Standard IPC Class 2, IPC Class 3, Millitary
Application Industrial, Automotive, Consumer,Telecom, Medical, Military, Security ect.
Other 3+N+3 to any layer

HDI circuit board advantages:
1. Reduce PCB cost: when the density of PCB increases more than eight layers, it will be manufactured with HDI, and the cost will be lower than that of the traditional pressing process;
2. Increase circuit density: interconnection between traditional circuit board and parts;
3. Conducive to the use of advanced construction technology;
4. Better electrical performance and signal correctness;
5. Better reliability;
6. Improve the thermal properties;
7. Improve RF interference, electromagnetic interference and electrostatic discharge (RFI/EMI/ESD);
8. Increase design efficiency.

Maybe we don't have the lowest price, but can guarantee you the best quality.
If you are interested, welcome to contact us. Here is the contact information as follows:
Shanghai Gawin Electronic Technology Co., Ltd.
Web: gawinpcba.en.made-in-china.com


Main Inspection Equipement
12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
12layer Rigid PCB Tg170 1.8mm HDI 2+N+2 OSP+Enig Blind Via Impedance Control
 

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