| Customization: | Available |
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| Conductive Type: | Unipolar Integrated Circuit |
| Integration: | GSI |
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| Count | 4Layer |
| Material | Shengyi S1141 |
| Board Thickness | 1.6+/-0.14mm |
| Board Size | 211mm*182mm |
| Min. Drilling | 0.2mm |
| Surface Finish | HASL-LF |
| Min. Trace Width | 0.254mm |
| Min. Space line | 0.228mm |
| HDI Layer Count | 4L-32L mass production, 34L-64L quick-turn |
| Material | High Tg material (Recommend Shengyi Material) |
| Finished Board Thickness | 0.8-4.8mm |
| Finished Copper Thickness | Hoz-8oz |
| Max. Board Size | 600X800mm |
| Min. Drilling Size | 0.15mm, 0.1mm(laser drilling) |
| Blind/Buried vias depth ratio | 1:1 |
| Min. Line Width/Space | inner 2/2mil, outer 3/3mil |
| Surface Finish | ENIG, Immersiong Silver, Immersion Sn, Plated Gold, Plated Sn, OSP ect. |
| Standard | IPC Class 2, IPC Class 3, Millitary |
| Application | Industrial, Automotive, Consumer,Telecom, Medical, Military, Security ect. |
| Other | 3+N+3 to any layer |
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