Customization: | Available |
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Structure: | Multilayer PCB+FPC |
Material: | Polyimide |
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Smart Flex-rigid PCB
Number of layers: 2 layers
Thickness: 1.6 mm
Size: 293.37mm*203.2mm
Material: FR4+PI+NFPP
Min. Drilling Size: 0.4mm
Min. Trace width: 0.305mm
Min. Space: 0.406mm
Surface Finish: Immersion Gold
Structure: upper and lower asymmetric structure
Parameters | Rigid-flex PCBs |
Standard Panel Size | 500x600mm |
Copper Thickness | 6 OZ |
Final Thickness | 0.06-6.0mm |
Layer Count | Up to 20L |
Material | PI, PET, PEN, FR4, PI |
Min Line Width/Spacing | 3/3mil |
Min Drill Hole Size | 6mil |
Min Via (Laser)Size | 4mil |
Min Micro Via (Laser)Size | 4mil |
Min Slot Size | 24milx35mil (0.6x0.9mm) |
Min Hole Ring | |
Inner 1/2OZ | 4mil (0.10 mm) |
Inner 1OZ | 5mil (0.13 mm) |
Inner 2OZ | 7mil (0.18mm) |
Outer 1/3-1/2OZ | 5mil (0.13 mm) |
Outer 1OZ | 5mil (0.13 mm) |
Outer 1OZ | 8mil (0.20mm) |
Stiffener | |
Stiffener Material | Polyimide/FR4 |
PI Stiffener Registration | 10mil (0.25mm) |
PI Stiffener Tolerance | 10% |
FR4 Stiffener Registration | 10mil (0.25mm) |
FR4 Stiffener Tolerance | 10% |
Coverlay Color | White, Black, Yellow, Transparent |
Surface Finish | |
ENIG | Ni: 100-200μ'', Au: 1-4μ'' |
OSP | 8-20μ'' |
Immersion Silver | Silver: 6-12μ'' |
Gold Plating | Ni: 100-200μ'', Au: 1-15μ'' |
Outline Tolerance of Punch | |
Precision Mould | +/-3mil (0.08 mm) |
Ordinary Mould | +/-4mil (0.10 mm) |
Knife Mould | +/-9mil (0.23 mm) |
Hand Cutting | +/-16mil (0.41 mm) |
Electrical Test Voltage | 50-300V |