Products Type: Communication HDI Board
Count:8Layer (1+6+1)
Board Thickness:1.6mm
Board Size:200mm*120mm
Material:FR4 Tg170
Min. Drilling:0.1mm
Surface Finished:Immersion + OSP
Application Fields:Communications
Specialty:Overlay blind and buried via
HDI Layer Count |
4L-32L mass production, 34L-64L quick-turn |
Material |
High Tg material (Recommend Shengyi Material) |
Finished Board Thickness |
0.8-4.8mm |
Finished Copper Thickness |
Hoz-8oz |
Max. Board Size |
600X800mm |
Min. Drilling Size |
0.15mm, 0.1mm(laser drilling) |
Blind/Buried vias depth ratio |
1:1 |
Min. Line Width/Space |
inner 2/2mil, outer 3/3mil |
Surface Finish |
ENIG, Immersiong Silver, Immersion Sn, Plated Gold, Plated Sn, OSP ect. |
Standard |
IPC Class 2, IPC Class 3, Millitary |
Application |
Industrial, Automotive, Consumer,Telecom, Medical, Military, Security ect. |
Other |
3+N+3 to any layer |
HDI circuit board advantages:
1. Reduce PCB cost: when the density of PCB increases more than eight layers, it will be manufactured with HDI, and the cost will be lower than that of the traditional pressing process;
2. Increase circuit density: interconnection between traditional circuit board and parts;
3. Conducive to the use of advanced construction technology;
4. Better electrical performance and signal correctness;
5. Better reliability;
6. Improve the thermal properties;
7. Improve RF interference, electromagnetic interference and electrostatic discharge (RFI/EMI/ESD);
8. Increase design efficiency.
Maybe we don't have the lowest price, but can guarantee you the best quality.
If you are interested, welcome to contact us. Here is the contact information as follows:
Shanghai Gawin Electronic Technology Co., Ltd.
Web: gawinpcba.en.made-in-china.com
Main Inspection Equipement