10layer Rigid-Flex PCB Board with High Density Interconnect Technology for Medical Device

• Customization: Available
• Structure: Multilayer PCB+FPC
• Material: Polyimide
• Combination Mode: Adhesive Flexible Plate
• Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Medical Device
• Conductive Adhesive: Conductive Silver Paste
• Flame Retardant Properties: V0
• Processing Technology: Enig
• Base Material: Fr4+Pi+Nfpp
• Insulation Materials: Organic Resin
• Blind Vias: 0.1mm
• Buried Vias: 0.1mm
• Transport Package: Vacuum + Carton Packing
• Origin: Made in China
• HS Code: 8534001000
• Production Capacity: 500000PCS/Month
• Package Size: 10.00cm * 10.00cm * 10.00cm
• Package Gross Weight: 1.000kg

Product Description

10Layer Flex-rigid PCB

Number of layers: 10 layers

Thickness: 1.6 mm+0.15mm

Material: Al+PI+NFPP

Min. Drilling Size: 0.2mm

Min. Trace width: 0.1mm

Min. Space: 0.1mm

Surface Finish: Immersion Gold

Why is flex-rigid PCB?
The flex-rigid PCB is a printed circuit board formed by the clever design and connection of a thin layer of flexible bottom layer and a rigid bottom layer, which is then pressed into a single component. It has changed the traditional planar design concept and expanded to the three-dimensional space concept, bringing great convenience to the design of electronic products.
The application range of the rigid-flex PCB mainly includes advanced medical equipment, digital camera, portable camera, high quality MP3 player and aerospace. Its main advantages are as follows:
1. Realize three-dimensional assembly, save assembly space, and make electronic products smaller and lighter;
2. The design of the rigid-flex PCB can use a single component to replace the composite PCB connected by multiple connectors, multiple cables and ribbon cables. And the performance is stronger, the stability is higher.

Flex-rigid PCB Capability
 

Parameters	Rigid-flex PCBs
Standard Panel Size	500x600mm
Copper Thickness	6 OZ
Final Thickness	0.06-6.0mm
Layer Count	Up to 20L
Material	PI, PET, PEN, FR4, PI
Min Line Width/Spacing	3/3mil
Min Drill Hole Size	6mil
Min Via (Laser)Size	4mil
Min Micro Via (Laser)Size	4mil
Min Slot Size	24milx35mil   (0.6x0.9mm)
Min Hole Ring
Inner 1/2OZ	4mil   (0.10 mm)
Inner 1OZ	5mil   (0.13 mm)
Inner 2OZ	7mil   (0.18mm)
Outer 1/3-1/2OZ	5mil   (0.13 mm)
Outer 1OZ	5mil   (0.13 mm)
Outer 1OZ	8mil   (0.20mm)
Stiffener
Stiffener Material	Polyimide/FR4
PI Stiffener Registration	10mil   (0.25mm)
PI Stiffener Tolerance	10%
FR4 Stiffener Registration	10mil (0.25mm)
FR4 Stiffener Tolerance	10%
Coverlay Color	White, Black, Yellow, Transparent
Surface Finish
ENIG	Ni:   100-200μ'', Au: 1-4μ''
OSP	8-20μ''
Immersion Silver	Silver:   6-12μ''
Gold Plating	Ni:   100-200μ'', Au: 1-15μ''
Outline Tolerance of Punch
Precision Mould	+/-3mil   (0.08 mm)
Ordinary Mould	+/-4mil   (0.10 mm)
Knife Mould	+/-9mil   (0.23 mm)
Hand Cutting	+/-16mil   (0.41 mm)
Electrical Test Voltage	50-300V

Flex-rigid Main Equipment