6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module

Product Details
Customization: Available
Type: Rigid Circuit Board
Dielectric: FR-4
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  • 6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
  • 6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
  • 6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
  • 6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
  • 6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
  • 6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
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Basic Info.

Model NO.
GW-1920421671
Material
Paper Phenolic Copper Foil Substrate
Application
Medical Instruments
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Fr4 Shengyi High Tg170
Insulation Materials
Epoxy Resin
Brand
1
Layer Count
4-64layer Through Hole Board
Surface Finish
Immersion Gold
Hole Wall Cu
Min. 20um
Min. Trace Width/Space
3/3mil
Standard
Ipc II
Certification
Ts16949
Transport Package
Vacuum + Carton Packing
Specification
1
Trademark
1
Origin
Made in China
HS Code
8534001000
Production Capacity
500000PCS/Month

Packaging & Delivery

Package Size
10.00cm * 20.00cm * 10.00cm
Package Gross Weight
1.000kg

Product Description

Products: 6Layer PCB 1.0mm with Immersion Gold, BGA to line 3mil for Consumer Electronics Module

PCBs Capabilities

Max.Board Thickness: 10mm
Min. Trace Width/Space: Inner 2.5/2.5mil, Outer 3/3mil
Trace Width/Spacing Tolerance:±20%; ±10% for signal trace areas by special control
Max. Copper Weight (Inner/Outer Layer): 12oz
Min. Drilling Size: Mechanical 0.15mm, Laser 0.1mm
Max. Unit PCB Size: 800mmX520mm
Max. Delivery Panel Size: 1200mm×570mm
Max. Aspect Ratio: 18:1
Special Materials:
1, Lead-free/Halogen-free: EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF;
2, High Speed: Megtron6, Megtron4,Megtron7,TU872SLK,FR408HR,N4000-13 Series,MW4000,MW2000,TU933;
3, High Frequency: Ro3003, Ro3006, Ro4350B,Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27;
4, FPC Materials: Polyimide, Tk, LCP, BT, C-ply,Fradflex, Omega , ZBC2000.
Surface Finish: LF-HASL, ENIG, Imm-Ag, Imm-Sn, OSP, ENEPIG, Gold Finger etc.
Impedance Tolerance: ±8%
High Layer Count PCBs
High layer count PCBs, widely found in file servers, military electronics, GPS technology, large scare equipement, data storage, satellite systems, weather analysis and medical equipment are usually ≥12L with special performance requirement raw material. 
 
PCB Engineering and Design Services
Gawin-Tech believes that pre-engineering talk before the final design can always ensure a good final product. Our engineering design plays a vital role in the functionality, performance, cost, and available supply chain and so on, which is the key to the success of the product. Based on advanced hardware and software, We always dedicate itself to the customer's design-in with professional domestic and abroad team. Provide support design solution like customized DFM routinely.
Customized Project Team
DFM
Advanced hardware and software
- InPlan
- InCAM
- InSolver
- Genesis 2000
- CAM 350
Auto CAD
Simulation Equipment
- TDR
- VNA
ISO 17025 /CNAS Qualified Reliability Test Capability

Maybe we don't have the lowest price, but can guarantee you the best quality.
If you are interested, welcome to contact us. Here is the contact information as follows:
Shanghai Gawin Electronic Technology Co., Ltd.
Web: gawinpcba.en.made-in-china.com


Main Equipement
6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module

6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module
6layer PCB 1.0mm with Immersion Gold, BGA to Line 3mil for Consumer Electronics Module


 

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