Customization: | Available |
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Conductive Type: | Unipolar Integrated Circuit |
Integration: | GSI |
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Product Parameter
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Item(pcb)
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Capability (pcb)
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Base Material
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FR-4 / High TG FR-4 / Halogen Free material/Rogers/Arlon/Taconic/Teflon
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Layers
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1-40
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Finised inner/outer copper thickness
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1-6OZ
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Finished board thickness
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0.2-7.0mm
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Min hole size
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Mechanical hole: 0.15mm Laser hole: 0.1mm |
Controlled Impedance
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+/-5%
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Plugging vias capability
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0.2-0.8mm
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Outline profile
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Rout/ V-cut/ Bridge/ Stamp hole
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Surface treatment
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HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP…
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Lead Time
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Layer
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Quick Turn/Usual Time
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Mass production
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2L
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24hours/ 4-5days
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8-10days
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4L
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48hours/ 6-7days
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10-12days
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6L
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72hours/ 7-8days
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12-14days
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8L
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72hours/ 8-10days
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16-18days
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10L
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96hours/ 12-14days
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18-20days
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