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High Multilayer 16layer Immersion Gold Circuit Board PCB for Telecommunication Motherboard pictures & photos
High Multilayer 16layer Immersion Gold Circuit Board PCB for Telecommunication Motherboard pictures & photos
High Multilayer 16layer Immersion Gold Circuit Board PCB for Telecommunication Motherboard pictures & photos
High Multilayer 16layer Immersion Gold Circuit Board PCB for Telecommunication Motherboard pictures & photos
High Multilayer 16layer Immersion Gold Circuit Board PCB for Telecommunication Motherboard pictures & photos
High Multilayer 16layer Immersion Gold Circuit Board PCB for Telecommunication Motherboard pictures & photos
  • High Multilayer 16layer Immersion Gold Circuit Board PCB for Telecommunication Motherboard
  • High Multilayer 16layer Immersion Gold Circuit Board PCB for Telecommunication Motherboard
  • High Multilayer 16layer Immersion Gold Circuit Board PCB for Telecommunication Motherboard
  • High Multilayer 16layer Immersion Gold Circuit Board PCB for Telecommunication Motherboard
  • High Multilayer 16layer Immersion Gold Circuit Board PCB for Telecommunication Motherboard
  • High Multilayer 16layer Immersion Gold Circuit Board PCB for Telecommunication Motherboard
Structure: Multilayer Rigid PCB
Dielectric: FR-4
Material: Epoxy Paper Laminate
Application: Communication
Flame Retardant Properties: V0
Processing Technology: Electrolytic Foil
Samples:
US$ 1/Piece 1 Piece(Min.Order)
| Request Sample
1
Customization:

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